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PROCESS DETAIL · AP-007
Process DetailPlating Process of LDS·Intenna Parts Manufacturer
AP-007 · Plating Process of LDS·Intenna Parts ManufacturerAP-007 · Antenna · MID
PROCESS INFORMATION · AP-007
Plating Process of LDS·Intenna Parts Manufacturer
Antenna · MID- Process ID
- AP-007
- Process Categories
- Antenna · MID
- Applications
- Antennas, automotive airbags, hearing aids, connectors, and sensors
- Related Industries
- Antenna · MID · electronic components
Process Sequence
14 steps
| Process order | Process Name | Process Description | Recommended product |
|---|---|---|---|
| 1 | Alkaline degreasing | Laser dust removal and surface activation | |
| 2 | 3-step rinsing | — | — |
| 3 | Electroless copper (strike) | Provide activity to circuit | MSMID-70/80 Process |
| 4 | 3-step rinsing | — | — |
| 5 | Wireless Copper (Build) | Build-up (Cu 10~15㎛) | MSMID-70/80 Process |
| 6 | 3-step rinsing | — | — |
| 7 | Pre-Dip | — | — |
| 8 | Electroless nickel | Medium-temperature electroless nickel | MSMID-MP600 |
| 9 | 3-step rinsing | — | — |
| 10 | Electroless gold | Additional upon client requirements | MSMID-GOLD M |
| 11 | 3-step rinsing | — | — |
| 12 | Post-treatment | Discoloration prevention treatment | SG-1 |
| 13 | 3-step rinsing | — | — |
| 14 | Drying | — | — |
Pre-treatment
Material preparation
- STEP1
- 23-step rinsing
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