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PRODUCT DETAIL · PI-0119
Product DetailsMS-AG-400
PI-0119 · MS-AG-400PI-0119 · Semiconductor / Tin Alloy – Sn-Ag-Cu
PRODUCT · PI-0119
MS-AG-400
Tin Alloy – Sn-Ag-CuProduct Features
Copper Core Solder Ball Plating Solution Copper core solder balls are manufactured by forming a nickel layer and a tin-silver-copper (Sn-Ag-Cu) alloy layer on the surface of a copper ball. They are used as an alternative to conventional solder balls to maintain mechanical stability and improve electrical and thermal performance.Conventional solder balls melt completely during reflow and may flatten, whereas the solid copper core acts as a structural support, precisely maintaining the gap between the chip and the substrate after reflow. The copper core generally offers significantly higher thermal and electrical conductivity than conventional tin-based solder.This helps dissipate heat generated by high-performance chips more quickly and reduce signal loss. This plating solution is used to manufacture copper core solder balls.Their main applications include high-density packaging in advanced semiconductor packaging, as well as high-power and high-performance semiconductors.
PRODUCT SPECIFICATION · PI-0119
MS-AG-400
Semiconductor / Tin Alloy – Sn-Ag-CuProduct Information
- Product ID
- PI-0119
- Product Group
- Tin Alloy – Sn-Ag-Cu ↗Tin Alloy – Sn-Ag-Cu ↗
- Features
- Copper Core Solder Ball Plating Solution Copper core solder balls are manufactured by forming a nickel layer and a tin-silver-copper (Sn-Ag-Cu) alloy layer on the surface of a copper ball. They are used as an alternative to conventional solder balls to maintain mechanical stability and improve electrical and thermal performance. Conventional solder balls melt completely during reflow and may flatten, whereas the solid copper core acts as a structural support, precisely maintaining the gap between the chip and the substrate after reflow. The copper core generally offers significantly higher thermal and electrical conductivity than conventional tin-based solder. This helps dissipate heat generated by high-performance chips more quickly and reduce signal loss. This plating solution is used to manufacture copper core solder balls. Their main applications include high-density packaging in advanced semiconductor packaging, as well as high-power and high-performance semiconductors.